Electronics Forum | Thu Oct 11 14:44:46 EDT 2007 | bbarton
Lots of papers out there on HiFreq circuits and the effects of solder paste residue. Google Dr. Karen Tellefsen. Simple test...take a "failed" board, remove the residues, test again. Has the problem gone away?
Electronics Forum | Mon Nov 05 19:43:09 EST 2007 | davef
"Effects of surface finish on high frequency signal loss using various substrate materials" - Call Don Cullen at Mac Dermid or Larry Gatewood at Rockwell Collins for a copy.
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
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SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030 Solder Joint Reliability Under Realistic Service Conditions. P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
(thermal fatigue reliability) by 23%. The photomicrographs taken from orthogonal cross sections of failed thermal cycling samples show that microvoiding and its effects on crack propagation are not always evident or easy to detect using
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