Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
High Quality PCB Co., Limited is a leading of PCB Manufacturer in China since 1995. Main products: IC Substrates, High Density Interconnect PCB, Multi-layer PCB, Rigid Flexible PCB, Flexible, Radio frequency PCB and PCB assembly.
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
JUKI RX-7R Pick and Place Machine Applicable Components: 03015 chip ~ 25mm square elementBoard size:510mm×450mmFeeder inputs:max 76placement capacity:75,000CPHProduct description: JUKI RX-7R Modular Pick and Place Machine,Applicable Components: 0301
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Thu Sep 30 11:23:41 EDT 1999 | Wolfgang Busko
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Used SMT Equipment | Pick and Place/Feeders
Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and"flexibility" 100000 CPH (IPC9850) high-speedproductivity There are three mount head types to choosefrom Only 1 m wide, small body Wi
Used SMT Equipment | SMT Equipment
Product name: YSM40 high density modular chip mounter Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and "flexibility" 100000 CPH (IPC9850) high-speed productivity There are three mount head types to ch
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-03-20 08:12:57.0
Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2009-02-26 03:25:09.0
STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management
QXJ-NC32 SMT pick and place nozzle cleaning machine In the field of the semiconductor industry today, with the development of SMT, small parts into small, high-density mounting and base for reality, and future development trends will be further co
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,
Ultra High Density Interconnect Conference
Career Center | Malibu, California USA | Management
Title: President / General Manager Location: Southern California Experience: P&L Technical degree Supervise: QA, Operations, engineering & marketing 10 years plus high-density electronic components Salary: $150K + Email resume to: tmyers@electronicc
Career Center | Marietta, Georgia USA | Engineering,Production
Currently seeking a senior pcb designer with Veribest cad experience. Knowledge of RF circuit design parameters, high density, multi-layer, and double sided. Analog/digital smd circuit board strongly desired. Designer will be responsible for pcb boar
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/info-center/news/nordson-introduces-the-encore-hd-mobile-powder-spray-system-at-fabtech
Nordson Introduces the Encore® HD Mobile Powder Spray System at FABTECH; Proven High-Density, Low-Velocity Technology in a Powerful Mobile Unit Industrial Coating Systems Corporate | Global Directory
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Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
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