Industry Directory | Manufacturer's Representative
1-High layer count PCB manufacturer. 2-Flip chip plastic substrate manufacturer.
We are a large, Taiwan based, printed circuit board manufacture We specialize in high layer count, HDI process, impedance control and special materials with equipment such as laser drill and horizontal plating
New Equipment | Fabrication Services
MPCS has vast experience building high layer count multilayers. Layer counts above 30 are subject to review.
Requiring a combination of leading-edge technologies, proven expertise and experience, effective board layout is the foundation of a successful product. At NBS, we utilize the very latest technologies such as Cadence� Allegro� and Valor� software to
Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Tue Aug 17 10:48:16 EDT 1999 | Earl Moon
| | | | | | Ladies and Gentlemen, | | | | | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally f
Industry News | 2003-03-24 09:38:49.0
Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Technical Library | 2012-09-27 19:50:01.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembl
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Career Center | Tucson, AZ, Arizona USA | Sales/Marketing
ACCOUNT MANAGER Location: West Coast - United States Job Description: The sales organization representing a Global top ten PCB manufacturer seeks a senior level account manager for Bay area accounts. Required is ten plus years of experience in
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards SMTnet Express September 27, 2012, Subscribers: 25503, Members: Companies: 8996, Users: 33716 A Novel Material for High Layer Count and High Reliability Printed
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
