Industry News | 2012-05-15 11:23:39.0
Tim O’Neill, Northeastern Regional Sales Manager, will present on Lead-Free Alloy Development at the Ohio Valley SMTA Solder Paste Round Table Meeting,
Industry News | 2012-08-01 16:22:42.0
AIMannounces that Luke Chen will present at the upcoming SMTA China South Conference
Industry News | 2018-11-16 15:48:54.0
Viscom announces that it was awarded a 2018 Mexico Technology Award in the category of Inspection Equipment – X-ray for its X7056-II automatic 3D X-ray inspection system. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2022-04-13 09:47:35.0
MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Industry News | 2007-10-12 11:18:05.0
Kasion Automation Limited, founded in 1992, provides exceptional service to the marketplace in China. For the past 15 years, Kasion has successfully built a strong base of customers, offices, infrastructure as well as a strong, experienced staff. Kasion celebrated this milestone on 28 September 2007 at the Sheraton Shenzhen Futian Hotel, in Shenzhen, China before the start of the week-long �China National Day.�
Industry News | 2013-01-10 11:18:35.0
Datest, will highlight its testing, engineering, and training services in Booth #244 at the upcoming Medical Design & Manufacturing (MD&M) West Exposition, scheduled to take place February 12-14, 2013 at the Anaheim Convention Center in Anaheim, California.
Industry News | 2014-10-30 19:03:02.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Etek’s Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.”
Industry News | 2015-03-03 13:11:14.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
