Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo
Industry News | 2012-03-19 17:35:52.0
AIM announces that Karl Seelig, Vice President of Technology, will present at the upcoming International Conference on Soldering & Reliability
Industry News | 2015-04-10 15:53:44.0
Blue Thunder Technologies will offer LOCTITE GC 10, named "The Game Changer"
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
New Equipment | ESD Control Supplies
CONTACT ME（Charlene ） WhatsApp no.: +86- 18020714492 Skype&Email: sales5@askplc.com DETAIL INFORMATION Brand: ABB Item no.: DSQC352 Lead time: 2-3 days Payment:T/T Color: metal color Product ori
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
Industry News | 2016-02-16 20:18:38.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Industry News | 2010-01-11 14:37:46.0
January 2010 ? Christopher Associates, a pioneering supplier to the electronics manufacturing industry, announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will host a SMTA-sponsored Webinar titled “Reducing Head-in-Pillow with Tin/Lead and Lead-Free Solder Paste Development.” The Webinar will be held on Thursday, February 4, 2010 at 11 a.m. USA Eastern/8 a.m. USA Pacific time, and will run for approximately 60-90 minutes with a question and answer period.
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