Electronics Forum | Wed Sep 06 05:55:15 EDT 2000 | randy
Our R&D uses Land Pattern Design based on Manufacturer's recommendation and not IPC Standard Land Pattern design. I suggested to shift to IPC but he just ignored me and laughed about it. We are encountering hips of wrong land pattern design since we
Electronics Forum | Sun Sep 24 09:40:33 EDT 2006 | davef
Roland It's nice that Peter is considering improving the site. Things we'd like to see improved on SMTnet.com are: * SEARCH that works effectively. [We can't find postings that we've made. AND we know the key words. So, it must be painful for oth
Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9
Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b
Electronics Forum | Tue Mar 17 11:57:39 EST 1998 | Richard
| Jim and all, | I am with SMTnet and want to thank all of you for | your participation in the SMT Forum. The recent slow | down of the forum was caused by three factors: | 1. The amount of data has increased. We keep | 3 months worth of messages
Electronics Forum | Thu Aug 17 01:31:31 EDT 2000 | Dreamsniper
Steve, I'm using 5 Sn/1.5 Ag/93.5 Pb Solder wire with a melting point of 300 deg. C to connect my thermocouples on smd components for thermal profiling. I'm using a soldering iron with an adjustable temp. to be able to melt my solder wire. Temp is ab
Electronics Forum | Wed Jan 21 11:02:41 EST 2004 | highfallsfunding
Hi Andreas. The SMPI is a proprietary Universal board transfer protocol. GSM platforms from about 1996 and newer have both SMEMA and SMPI. Although UIC later called it BPP1 (Board Pass Protocol) and BPP2, which is basically SMPI for lane-1 and SMP
Electronics Forum | Thu Mar 13 15:17:03 EDT 2008 | slthomas
about WHY violating IPC design standards gives you grief? Do they even know they exist? We've got one in particular that seems to shoot from the hip. I want to tell them the "why" as well as the "what" so they'll be a little more proactive. My fee
Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper
Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
