Professional trainer/coordinator for electronic assemblies, surface mount and plated through-hole printed wiring boards
Industry Directory | Manufacturer's Representative
Sales rep for worlds leading mfg. (LPKF) of rapid PCB prototyping equip. for making PCB prototypes IN-HOUSE WITHOUT CHEMICALS. Also, through-hole plating equip. and SMD pick and place equip. TERRITORY; Illinois, Indiana and Wisconsin.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef
Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo
Used SMT Equipment | Soldering - Wave
Senju Lead Free Wave SPF-300 Very Nice clean machine Dual Wave Solder No Nitrogen No Top Preheat Zones 355mm Max PCB width 3x Bottom Radiant Preheat Zones SPF-300
Used SMT Equipment | Other Equipment
200 µm. • Ideal for through-hole plating multilayer PCBs. • Number of through-plated holes: No limit. • Maximum number of layers: 8. • Maximum contact resistance: 10 mΩ. • Chemical thinning: Yes. • Activator: Carbon.
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2003-02-18 08:52:21.0
Placed Another Order for an ELX6146 High-speed Emma Test System from Viking Test Services
Parts & Supplies | Chipshooters / Chip Mounters
156780 DAMPER MOUNT, FRONT RIGHT 156779 DAMPER MOUNT 156775 HINGE PLATE, TOP LEFT 156774 HINGE ARM, SHORT 156773 HINGE ARM, LONG 156772 HINGE PLATE 156748 HOLE PLATE 156382 PUSH IN BASE & TIE 133364 BUFFER STOP ASSY. 117376
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Parts & Supplies | SMT Equipment
We also supply following Panasonic Spare parts : KXF029JAA00 JOINT KXF0DXLKA00 HINGE KXF0DYJGA00 WASHER KXF0C7NAA00 BOLT KXF01F0AA00 BALL-CATCH KXF0DXNKA00 KEY KXF0DYUXA00 SENSOR KXF09PDAA00 HANDLE KXF0CJGAA00 SPRING KXF09ZTAA00 SPACER K
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Pullman, Washington USA | Engineering
The Opportunity: Schweitzer Engineering Laboratories (SEL) seeks a professional, innovative and detailed individual for our Manufacturing Engineer position. If you are looking for an opportunity to contribute your skills and abilities to our growing
Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351-mounting-hole-naming-convention-info_topic619_post3051.html
), just a clean hole through the FR4 material. The mfr. desmears plated holes, but non-plated holes are plugged or masked during the plating process
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipcipc-6012-certified-ipc-specialist/
. Objective Learners will have the ability to understand criteria such as: Material selection for procurement Surface finishes Hole plating thickness Copper cap plating of filled holes Laminate cracks, voids, measling
