Electronics Forum | Wed Dec 22 12:39:38 EST 1999 | Dave F
Wolfgang: From US baseball parlance: Home Plate. A five sided, two dimensional, closed shape where three equal length sides form a cube with one side removed and two additional equal length sides that form interior angles of 135�, 90�, and 135�.
Electronics Forum | Mon May 03 11:26:53 EDT 1999 | Dave F
John: Homeplate is a reference from that American version of cricket ... baseball. In baseball, the pitcher throws the ball towards the batter and the ball must pass over homeplate to be considered to be strike. The ball also must be between the b
Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman
Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Wed Feb 12 17:41:18 EST 2003 | MA/NY DDave
Hi, Gee David F is as bad or as good as me on a bad day. Boy can I get mad... "new information" Many of these defects have been around so dang long and seem to get recycled as the latest rage and the newest of new information in technical articles
Electronics Forum | Wed Jun 01 07:34:19 EDT 2005 | davef
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature. We print paste 1:1 with the pad. �IPC-7351 LP Wizard� is the library mainten
Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG
Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i
Electronics Forum | Mon Apr 16 09:13:16 EDT 2007 | pjc
Tombstone head and a graveyard mind. I would not recommend 1:1 due to solderpaste beed out opportunities. Have you tried the inverted home-plate? Here are some good links on tombstoning and how to eliminate it: http://www.aimsolder.com/technical_ar
Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc
Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
