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ORION Industries

ORION Industries

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer

ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.

Investigation of PCB Failure after SMT Manufacturing Process

Technical Library | 2019-10-21 09:58:50.0

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).

ACI Technologies, Inc.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2020-02-26 23:24:02.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

Technical Library | 2020-12-07 15:26:06.0

Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.

ACI Technologies, Inc.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2021-06-15 15:17:33.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

I.C.T | Livestream 2.16

Industry News | 2023-02-16 02:26:06.0

This time I.C.T team will show you around our factory and talk about our hot sale PCB handling machine.

I.C.T

Hand Soldering & Component Rework Training

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Saki Solder Paste chambrieren machine,solder Paste softening machine

Saki Solder Paste chambrieren machine,solder Paste softening machine

Parts & Supplies | Solder Paste Mixers

Solder Paste chambrieren machine,solder Paste softening machine Description: Brand name:solder Paste chambrieren machine Type:4 slot Material:Hot steel spraying Power supply:220V(50Hz) Power:0.4Mpa Original:Shenzhen Weight:20KG Advantage:

KingFei SMT Tech

Juki L155E42100 FX-1 filter

Juki L155E42100 FX-1 filter

Parts & Supplies | Pick and Place/Feeders

L155E42100 FX-1 filter Model: JUKI placement machine Specification: Filter Part Number: L155E42100 Name: Filter 00336791S04 Siemens S60 camera AGGTF8021 FUJI XPF TRAY CBM-9230 reflow soldering furnace hot air motor DCPA2091 FUJI CP7 oil pum

ZK Electronic Technology Co., Limited

Fuji XP241 XP341 1.0 Nozzle Adepn8540

Fuji XP241 XP341 1.0 Nozzle Adepn8540

Parts & Supplies | Assembly Accessories

ADEPN8790 Fuji XP241 XP341 1.0 Nozzle Fuji Nozzle XP Nozzle It is a hot kind product with high quality and low cost, Most of Products from our company are OEM;It has a long service life, at least 3 years; Our company support replacing within 7 days

Jinchen Electric Technology Co,.Ltd


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