The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
Parts & Supplies | Circuit Board Assembly Products
1). PCB Thickness up to 5mm 2). FR-4 material, 1 oz copper finished 3). Green solder mask /white silk screen. 4). Blind/buried vias required. 5). Hot air level Pb free 6). Application: motor, medical equipment, industrial products.
Parts & Supplies | Circuit Board Assembly Products
1). 24 hours lead time. 2). FR-4 Material, Single sided or Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). 4/4 mil track/space, 0.3mm minimum holes 6). Hot air level finish
Parts & Supplies | Circuit Board Assembly Products
1). Any different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
Industry Directory | Manufacturer / Manufacturer's Representative
MANUFACTURER OF WAVE SOLDERING MACHINE,REFLOW/CURING MACHINE,CONFORMAL COATING MACHINE,DIP TINNING POT,HOT AIR LEVELING MACHINE,HOT BAR SOLDER MACHINE,DISTRIBUTOR FOR OTHER ASSEMBLY AND TEST EQUIPMENT
Technical Library | 1999-08-09 11:11:55.0
A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate.
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