New Equipment | Wave Soldering
Quick Overview Lead Free Best Solution M400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. M400 Lead Free Wave Solder Machine
New Equipment | Wave Soldering
Quick Overview Lead Free Best Solution S400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. S400 Lead Free Wave Solder Machine
New Equipment | Rework & Repair Equipment
The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others. The Thermaltronics TMT-HA200 Hot Air Tool is a portable and flexible hot air rework system. The Thermaltron
Industry News | 2018-05-06 18:13:20.0
Convection rework is becoming increasingly important due to the prevalence of surface mount components and the difficulty in using soldering irons to remove or replace such devices. To help overcome these difficulties, Thermaltronics, a manufacturer of soldering systems using the unique “Curie Point” Technology, has released a new, digital hot air pencil with adjustable controls for air and temperature.
New Equipment | Rework & Repair Equipment
The TMT-HA100 hot air pencil is designed to remove and reflow small precision components, integrated circuits and other smaller devices. The Thermaltronics TMT-HA100 hot air pencil is a portable and flexible hot air rework system. The Thermaltronics
New Equipment | Rework & Repair Equipment
The TMT-HA600 is suitable for the more difficult applications in the removal and reflow of surface mount components. The TMT-HA600 hot air tool uses a large diaphragm pump and a high power 1300W heater, designed to work on more difficult application
New Equipment | Rework & Repair Equipment
The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others. The Thermaltronics TMT-HA300 Hot Air Tool is a portable and flexible hot ai
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
