Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Industry Directory | Manufacturer
Suppliers of adhesive and dispensing solutions. Techcon dispensers, metering valves, robots, plastic components, air guns and accessories. Henkel Sicomet anaerobic and cyanoacrylate adhesives, Henkel Dexter epoxy resins and adhesives, Jenome dispensing robots. Keltech pressure pot dispensers. Packaging service for transfer of adhesives from drums, pots or cans into syringes and cartridges.
The system is an optimal solution for hot glue applications. Hot melt, a thermoplastic adhesive perfectly changes its solid state to liquid when passing through the zones of increasing temperature; an ideal application for the electronic industry, e.
Materials: Backing: flat back paper Adhesive: rubber Thickness: 0.13mm Adhesion: 7N/in Ball tack (No.#14): 10 Holding power: 72hrs Tensile strength: 150N/in Elongation: 1% Applications: widely used in masking of diode belting Features: Ada
Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.
Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t
Electronics Forum | Wed Dec 08 11:12:07 EST 1999 | Brian W.
I think the number is about 80 degrees C. If the board is hotter than that, glue problems start to occur. John is right. The adhesive starts its cure process and its release from the nozzle is inhibited. Fans and coolers are one way yo go. If yo
Used SMT Equipment | Soldering - Selective
PVA 3000 Dispenser (2012) Brand: PVA Model: 3000 Year: 2012 Serial #: W5339 Type: Dispenser Supply Voltage: 120 VAC, 60 Hz, 12 A Single phase Motion Axes: 3 Controller Axes: 4 Controller: 2000 - X-Stroke: 500mm - Y-Stroke: 500mm - Z-St
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Technical Library | 2021-05-13 16:03:25.0
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
SMT Auto Aqueous Stencil Cleaning Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machi
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
GPD Global | https://www.gpd-global.com/hot-melt-dispensing.php
Hot Melt Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_microjoin_4100hotbar_bonder.html
microjoin b4100 hot bar bonder Micro Join B-4100 Series Hot Melt Bar Bonder MicroJoin Model Number: B41CVBCA0B0DA00 Serial Number
