New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Electronics Forum | Fri Mar 14 08:38:15 EDT 2008 | davef
Pastes from different suppliers have different hot slump characteristics
Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22
Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc
Industry News | 2017-12-19 19:54:07.0
Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Industry News | 2013-05-01 11:03:43.0
FCT Assembly today announced that it won a major OEM in the Northwest with its NL932 lead-free no-clean solder paste. The OEM evaluated six solder paste suppliers.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
& Sealing Back Bonding & Sealing Bonding Gluing - Hot Melt Adhesive Gluing - Liquid Adhesive Sealing Soldering Coating Back Coating Coating - Conformal Coating - Container Coating - Fluid Coating - Hot Melt Adhesive Coating
