Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
New Equipment | Coating Materials
AccuSpec Electronic Services has the capability of producing both low and high volumes of potting assemblies ranging from the simplest of coating tasks to the most difficult potting needs. A variety of potting materials and conformal coatings are ava
Industry Directory | Manufacturer
Since 1985, Unit Design has been a leading manufacturer of soldering equipment, lead tinning systems and batch defluxing systems. We are commited to innovative technology, reliable equipment and great customer service.
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Industry Directory | Training Provider
IPC Training from BEST - a professional solder training company that certifies technicians in various IPC certification programs. We also offer custom BEST courses that include hand soldering and PCB rework.
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Parts & Supplies | Pick and Place/Feeders
Siemens SIEMENS SIPLAC X 8mm FEEDER Specs: Siemens SIEMENS SIPLACE X 2x8mm FEEDER Specs: Siemens SIEMENS SIPLACE 44mm FEEDER 00 Specs: Siemens SIEMENS SIPLACE 24,32mm FEEDER Specs: Siemens SIEMENS SIPLACE 12/16mm FEEDER Specs: Siemens SIEM
HP-520SPI Load a new program in 1 minute, 20 seconds Inspect a full size PCB in 8 seconds or less Closed Loop Feedback on X/Y, Theta, Insufficient-Excess Solder Paste and also Under Stencil Cleaning System
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
New Equipment | Board Handling - Conveyors
The Wave Solder Outfeed Conveyor is used to unload PCBs from the inclined conveyors of wave solder and to then lower the soldered boards to a standard conveyor height. The angle of the shorter inlet section can be adjusted to match the angle of the w
Industry Directory | Manufacturer
Electronic Interconnect (EI) is a professional PCB manufacturer in the USA since 1985, serving design engineers and contract assemblers. We can serve all proto to production PCB needs.
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