Electronics Forum: how and long and can and printing and sit (16)

Re: SMD Inspection and Touch-up

Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee

| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Industry News: how and long and can and printing and sit (17)

Nordson ASYMTEK and Nordson MARCH to Present Papers at Contamination, Cleaning, and Coating Conference in Amsterdam

Industry News | 2017-05-10 18:15:53.0

Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.

ASYMTEK Products | Nordson Electronics Solutions

Electronics and Textiles Come Together at IPC E-Textiles 2018

Industry News | 2018-06-04 18:00:34.0

If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.

Association Connecting Electronics Industries (IPC)

Technical Library: how and long and can and printing and sit (3)

7 Benefits of Choosing Professional PCB Manufacturers and Assemblers

Technical Library | 2020-05-28 02:19:28.0

Properly functioning printed circuit boards are essential for both manufacturers of electronic devices and also the developers if the overall intent is for the electronic device to function at high capacity. From designing the schematics of the printed circuit boards to testing the products, there is no process of PCB manufacturing and/or assembly that can be taken for granted. While it's true that you can attempt this process on your own, especially if you are in possession of a large scale manufacturing facility, here are a few reasons why it would be a better option to opt for a professional company for PCB manufacturing and assembly. 1. Variety A professional printed circuit boards manufacturing company will be able to offer you a huge variety. You will be able to choose from rigid, flexible, or rigid-flex. What's more, the PCBs will be customized as per the need of the application. 2. Quality Professional and good printed circuit board manufacturing and assembling companies might cost you just a little bit extra but they also guarantee to produce the best results and offer very high quality products. In the end, it is quality that will make the difference between mediocre and a high functioning PCB. 3. Cost Efficiency Since you don't have to waste time or resources on buying equipment to produce the best PCBs or hiring staff to oversee the process, you can actually end up saving money. You can even save on PCB assembly cost by hiring this job out. All you have to do is to negotiate the quote and sit back, relax, and wait for the PCBs to be delivered to you. 4. Eliminate Design Flaws Design engineers hired by PCB manufacturing and assembling companies use the best graphic software to develop and test the schematics of PCBs. This increases the chances of eliminating flaws in the printed circuit boards during the initial design phase. 5. Multilayer PCB Manufacturing and Assembly The process of manufacturing and assembling multilayer PCBs is as intricate as it sounds. All processes of manufacturing and assembling multilayer PCBs require the best machines and trained technicians to pass the quality and functionality tests. Manufacturing and assembling multilayer printed circuit boards yourself is going to cost you a lot. Even the smallest of mistakes during the manufacturing and assembling process might render the entire PCB entirely useless. 6. Save Time PCBs are just a single part of the electronic device. To complete the device, many more pieces would be needed. The manufacturers of the electronic device can hire out the job of manufacturing or assembling the PCBs, which will mean they will have one less chore to do. This, in turn, will save you a lot of time which could be spent on elevating the quality of the product. 7. Experience Experience makes all the difference. It is what makes the name of any company reliable in the market. Long experience of manufacturing and assembling printed circuit boards makes the company well versed in the process and it also makes it an expert to identify design, manufacturing, assembling, and testing needs of certain applications We, at Asia Pacific Circuits, offer these benefits and so much more. For quick turn PCB assembly, PCB manufacturing and PCB designing, you can contact us anytime.

Asia Pacific Circuits Co., Ltd

Innovative Electroplating Processes for IC Substrates - Via Fill, Through Hole Fill, and Embedded Trench Fill

Technical Library | 2021-06-21 19:34:02.0

In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.

MacDermid Inc.

Videos: how and long and can and printing and sit (2)

BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class

BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class

Videos

BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif

BEST Inc.

TI New and Original TPS2412PWR  in Stock  IC TSSOP-8, 2122+        package

TI New and Original TPS2412PWR in Stock IC TSSOP-8, 2122+ package

Videos

TI New and Original TPS2412PWR  in Stock  IC TSSOP-8, 2122+        package TPS2412PWR 0.8V to 16.5V, 1.2A IQ, 292uA Igate Sourcing, N+1 and OR-ing Power Rail Controller Today's Hot Deals: BTS724G SOP20 Infineon 21+ EN5329QI QFN24 altera 20+ LI

Shenzhen Fuwo Technology Co.,Ltd

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FAQ - PCB Product and Job Tracking Software | Unisoft

| https://unisoft-cim.com/cells_faq.htm

. The database is ODBC compliant and report generation tools such as Crystal reports etc. can be used. Back to top SPC/REPORTS — I did not see any menu selections for showing/printing SPC charts

Development Stage of SMT Pick and Place Machine - I.C.T SMT Machine

| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html

. along with With the continuous development of SMT and the miniaturization of components, this generation of pick and place machines has long been withdrawn from the market and can only be seen in individual small enterprises.   2


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