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How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Count On Tools Announces Customer Success with ezLOAD Board Support System

Industry News | 2014-01-07 18:55:28.0

Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.

Count On Tools, Inc.

FUJI SMT Placement AIMEX III

FUJI SMT Placement AIMEX III

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FUJI SMT Placement AIMEX III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, FUJI SMT m

Dongguan Intercontinental Technology Co., Ltd.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Videos

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

IPC and i4.0 Today to Host i4.0 Connect Forum

Industry News | 2018-09-17 19:08:00.0

Sixty-six percent of manufacturing companies say that their leadership does not have a clear vision for the digital future. As manufacturing moves toward the Smart Factory and Industry 4.0, IPC and i4.0 Today will offer members of the electronics industry an opportunity to learn about the technology and future surrounding Industry 4.0 with a two-day i4.0 Connect Forum, to take place in Silicon Valley, Calif., November 6-7.

Association Connecting Electronics Industries (IPC)

Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16

Industry News | 2008-01-07 14:27:27.0

Expands to Four-Day Event with Workshops, Presentations and Exhibits

Surface Mount Technology Association (SMTA)

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Industry News | 2022-10-11 17:18:48.0

Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve

Association Connecting Electronics Industries (IPC)

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Surface Mount Technology Association (SMTA)

WHMA 27th Annual Wire Harness Conference to Offer Workshop on the Evolution of IPC’s Cable and Wire Harness Documents

Industry News | 2019-10-30 18:25:26.0

Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)


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