New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2016-08-28 13:49:20.0
Altus Group, leading distributors of capital equipment for electronics assembly and Accelonix, dominant suppliers of electronic and precision manufacturing and test equipment have partnered to present an innovative technology showcase on 29th September 2016.
Industry News | 2023-04-03 13:28:07.0
TAGARNO has developed a new 'how to' guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level.
Industry News | 2013-05-14 12:24:08.0
Multitest offers innovative approaches for test strategies of 3D ICs and Sensors – Meet Multitest at ECTC, May 28-30, Las Vegas
Industry News | 2018-11-19 22:35:55.0
Aegis Software and CircuitByte announce that they will host an exclusive event located in Frankfurt, Germany on November 28th. Participants will see and learn how Aegis and CircuitByte together, bring the ultimate process engineering software solution for assembly manufacturers.
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
Events Calendar | Fri Oct 06 00:00:00 EDT 2023 - Fri Oct 06 00:00:00 EDT 2023 | Monterrey, Mexico
Mexico Technology Day 2023 - Exclusive 1 to 1 Technical Session with Complimentary AOI Test Report
Technical Library | 2017-07-24 16:28:06.0
Professionally assembling circuit boards used to be slow. Many circuit board manufacturers still take up to two weeks or longer to produce circuit boards according to customer design specifications.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
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