Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2021-11-24 15:39:47.0
Paper Titled '3D Inspection Is Becoming Essential in Advanced Packaging (AP)'
Effect Of Squeegee Blade On Solder Paste Print Quality Effect Of Squeegee Blade On Solder Paste Print Quality The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
EFD’s WS 71D00 solder paste is designed to wet challenging surfaces, including most 300 and 400 series stainless steels. No need for the higher expense of brazing when solder can do the job
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Ensure that printed circuit boards are dried properly before the application of solder, or make changes to control humidity in the manufacturing environment. Solder Paste
