Electronics Forum | Tue Nov 18 15:03:39 EST 2003 | Mark
Yup. I'm attempting a small, but very important experiment. I need to solder several Lead-Free Globtop BGA parts to a Pin-Socket interposer assembly. I'm trying to come up with the best way to do this. I'm thinking of using lead-free solder paste, (b
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Thu Jul 30 13:52:34 EDT 2009 | davef
Thoughts are: * 215-220 temperature at the leads is not real hot for leaded assembly. * It's peculiar for component leads to dewet. Sometimes non-wetting occurs along the edge of the lead where the lead is not plated. * How do the leads of a removed
Electronics Forum | Thu Jan 07 16:46:05 EST 1999 | Steve Gregory
Hey ya'll!! SUCCESS! I was able to get that monster off!...(Now I just gotta' be able to get it back on right...hehehe) If you remember, the whole reason I had to rework it was because somehow they got the hole positions wrong in the board for
Electronics Forum | Thu Mar 29 09:10:46 EDT 2007 | chrissieneale
Who out there uses a mini stencil to paste some paste when they replace a BGA and who uses just flux? What are the benefits or both and more importantly - how many times can you do both on the same component / board? Thanks in advance! Chrissie
Electronics Forum | Wed Jul 04 12:35:19 EDT 2001 | davef
I thought I responded this this a while ago, guess NOT!!! Wow, Dano yagot Entek boards that are that old!!!! Coo. Sounds kwazy that you�d end-up with that volume of old boards, but it�s probably one of those deals where correcting the problem keep
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
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