Full Site - : how to know msl on components? (Page 3 of 25)

Nordson ASYMTEK to Present Paper on Dispensing for Chip-on-Wafer Packaging and Poster on Coating Applications for EMI Shielding at IMAPS Device Packaging Conference

Industry News | 2017-03-06 12:46:42.0

Nordson ASYMTEK will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.

ASYMTEK Products | Nordson Electronics Solutions

Complying with the Moving Target of U.S. Export Controls - IPC Workshop to Provide Answers on Evolving ITAR and EAR

Industry News | 2011-09-19 18:12:59.0

In the realm of what you don’t know can hurt you, U.S. regulations on the import and export of sensitive electronics are constantly evolving. To help PCB manufacturers ensure compliance with International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR), IPC will hold a comprehensive workshop, ITAR/EAR Compliance for PCB Manufacturers - Complying with U.S. Export Controls, December 6–7, 2011, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

WHMA 27th Annual Wire Harness Conference to Offer Workshop on the Evolution of IPC’s Cable and Wire Harness Documents

Industry News | 2019-10-30 18:25:26.0

Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter to Host First Meeting of the Year on January 27th at DfR Solutions

Industry News | 2016-01-17 11:04:34.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on January 27th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter Invites You to Attend Its Annual Expo and Tech Forum on August 23, 2012

Industry News | 2012-08-09 18:20:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Industry News | 2017-08-01 06:01:06.0

The SMTA Capital Chapter is pleased to announce that Phil Zarrow of ITM Consulting, will present “The ‘Deadly Sins’ of SMT Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

“Test Plan Development – How to Do It!” to Be Presented by Dr. Gil Sharon on April 12th SMTA Capital Chapter Meeting at DfR Solutions

Industry News | 2016-03-31 18:28:07.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on April 12th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.

Surface Mount Technology Association (SMTA)

IPC and JEDEC Help Industry Transition to Lead Free Associations Host Conference on Transitioning to Lead Free � Strategies for Implementation

Industry News | 2009-02-21 17:56:00.0

BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.

Association Connecting Electronics Industries (IPC)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

From the Wild West to the IPC Hall of Fame

Industry News | 2012-02-28 14:26:18.0

Since the "wild west" days of a relatively young printed circuit board industry when rules and infrastructure were not yet well established, Dennis “Denny” Fritz has been actively involved in IPC activities to help add structure, strength and vision to the industry. Today, he was honored with the IPC Raymond E. Pritchard Hall of Fame Award for his dedication and service to IPC and the industry. Presented at IPC APEX EXPO® in San Diego, the Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)


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