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Gen3's Dr Chris Hunt, CTO to Present at SMTA Electronics in Harsh Environments Conference

Industry News | 2022-05-05 12:07:32.0

Gen3 a British manufacturer of testing and measuring the electronics industry announced that Dr Chris Hunt, CTO, will present during the SMTA Electronics in Harsh Environments Conference.

Gen3 Systems

Gen3's Dr Chris Hunt, CTO to Present at SMTA Electronics in Harsh Environments Conference

Industry News | 2022-05-05 12:07:38.0

Gen3 a British manufacturer of testing and measuring the electronics industry announced that Dr Chris Hunt, CTO, will present during the SMTA Electronics in Harsh Environments Conference.

Gen3 Systems

Saki to Demonstrate New AOI and SPI Systems at Productronica Stand A2.259

Industry News | 2017-11-10 17:38:29.0

Saki Corporation announces that it will introduce its new 3Di Automated Optical Inspection (AOI) systems at Productronica, stand A2.259. The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3Ơ), height repeatability (below 2µm at 3Ơ), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg.

SAKI America

Juki to Show New Advanced SMT Line up at APEX 2020

Industry News | 2020-01-02 14:43:12.0

Juki Automation Systems (JAS) will showcase the RS-1 Placement Machine, G-Titan Automated Screen Printer, JM-100 Insertion Machine featuring a new active clinching unit and Autonomous Material Handling System in Booth #2819 at the 2020 IPC APEX EXPO

Juki Automation Systems

Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX Booth 1127

Industry News | 2018-02-26 11:10:21.0

Saki Corporation will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX Expo, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.

SAKI America

Find Out How to Get the Best Value from Speedprint at SMTA International

Industry News | 2012-09-13 07:33:14.0

Speedprint Technology will exhibit in booth 622 at the upcoming SMTA International Conference and Expo

Speedprint Technology

Saki to Highlight Total Inspection Line Solutions and Local Service Strength at Productronica India

Industry News | 2023-09-04 13:59:43.0

Introducing high-precision total inspection line solutions to India's electronics manufacturers for the greatest level of quality assurance.

SAKI America

Nordson Test & Inspection to Demonstrate Best-in-Class Inspection and Metrology Systems at APEX 2023

Industry News | 2023-01-16 07:38:53.0

Nordson Test & Inspection today announced that it will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will highlight the multi-award-winning CyberOptics SQ3000™+ Multi-Function system for AOI, SPI and CMM, the M2 AOI system, the CyberOptics SE3000™ SPI system and Quadra 7 X-ray system in Booth #915.

Nordson Corporation

Juki Automation Systems to Launch New LX-8 High-Speed, Flexible Mounter at APEX 2023

Industry News | 2022-12-21 10:40:32.0

Juki Automation Systems (JAS), Inc. today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will launch the new LX-8 and demonstrate a range of equipment, including the RS-1R, RX-8, JM-50, iCube, RV-2 3DHL, G-Titan, Incoming Material Station and Autonomous Material Handling System in Booth #2700.

Juki Automation Systems

Koh Young Launches the Meister D+ for Semiconductor Package Inspection to the Americas Market

Industry News | 2021-10-11 08:08:21.0

Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.

Koh Young America, Inc.


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