Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Wed Jan 06 23:49:48 EST 1999 | Chris G.
| Hey All you Einsteins out there!! | | I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Oct 14 14:11:33 EDT 2021 | SMTA-64387257
Hi All, We are currently looking to add an Xray inspection system into our process. We build high density assemblies with ultra fine pitch BGAs, 0201's, QFN's and every package type one can think of. We would like to use the inspection system to v
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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