Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr
You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea
Electronics Forum | Thu Aug 09 09:14:22 EDT 2018 | ks0707
Is there any special machines/equipment which are able to install FBGA parts on the very thin flex boards for Printing, Pick & Place, and Reflow ? Q2> Is there any Fixture house who can offer fixtures to enable SMT processes for those assemblies ? Q
Electronics Forum | Thu Aug 09 16:24:27 EDT 2018 | ks0707
Hi Thomas, Thank you for your posting and I agree with you that Printing is the most difficult one. BTW, after you ran the one side (let's say Bottom side), my engineer worries about the distortion of flex board because of the thickness. In that ca
Electronics Forum | Tue Dec 14 09:32:59 EST 2004 | patrickbruneel
Hi Paul, One thing I can tell you for sure "lead free" is not going to solve your problem, because spectrum analysis have shown that dendrites at there final stage always consists of pure tin. The higher the tin content the higher the risk for dead
Electronics Forum | Thu Sep 24 10:19:55 EDT 1998 | Dave F
| i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrit
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
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