Industry Directory: how to solve solder bridging issue (2)

SolderLab.com

Industry Directory | Consultant / Service Provider

An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.

DIVSYS International-ICAPE, LLC

Industry Directory | Consultant / Service Provider / Manufacturer

Indianapolis-based PCB Sales & Supply Chain Management, PCB/PCBA Lab Services. Technical Experts who can actually assist you with board issues. Rapid Prototype Assembly to production standards.

New SMT Equipment: how to solve solder bridging issue (3)

Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

New Equipment | Reflow

Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro

T-KING Technology Co., Ltd.

USD4000/Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

USD4000/Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

New Equipment | Reflow

Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro

T-KING Technology Co., Ltd.

Electronics Forum: how to solve solder bridging issue (153)

Way to solve PCB warpage

Electronics Forum | Sat Dec 18 08:23:33 EST 2010 | remullis

I experienced warpage on a 7'x 13" long board, unfortunately my oven does not have center support. I use stiffeners on both of the short ends. It fixed my problem. Some of the things I was experiencing with the warpage on the second pass were placem

how to handle solder paste

Electronics Forum | Fri Nov 07 23:40:41 EST 2008 | padawanlinuxero

I have been working on the SMT area for a while now, must of my experience is on programming and pick and place, now in my new job I have to control a complete SMT line and I have a little knowledge on working with solder paste but I like to read mor

Used SMT Equipment: how to solve solder bridging issue (3)

Tektronix MDO4104-3

Tektronix MDO4104-3

Used SMT Equipment | In-Circuit Testers

Tektronix MDO4104-3 Mixed Domain Oscilloscope; 3 GHz RF input Mixed Domain Oscilloscope MDO4104-3 : Mixed Domain Oscilloscope with (4) 1 GHz analog channels, (16) digital channels, and (1) 3 GHz RF input MDO4104-6 : Mixed Domain Oscillosc

Test Equipment Connection

Tektronix MDO4104-6

Used SMT Equipment | In-Circuit Testers

Tektronix MDO4104-6 Mixed Domain Oscilloscope; 6 GHz RF input Mixed Domain Oscilloscope MDO4104-3 : Mixed Domain Oscilloscope with (4) 1 GHz analog channels, (16) digital channels, and (1) 3 GHz RF input MDO4104-6 : Mixed Domain Oscillosc

Test Equipment Connection

Industry News: how to solve solder bridging issue (167)

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

Technical Library: how to solve solder bridging issue (1)

How Detrimental Production Concerns Related to Solder Mask Residues Can Be Countered by Simple Operational Adaptations

Technical Library | 2019-09-19 00:28:48.0

The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a 'ping pong' conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name 'critical' soldermasks. It is also the intention of this paper to address the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. It is hoped that this awareness will help fabricators to ensure maximum yields by asking the right questions. 'Critical’ soldermasks impact all selective finishes. In this paper, practical experience using immersion tin will be used to highlight the relationship between 'critical' soldermasks and some of the issues seen in the field. The paper will include a novel approach to identify re-deposited volatiles after the reflow.

Atotech

Videos: how to solve solder bridging issue (6)

3D SPI manufacturer

3D SPI manufacturer

Videos

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用

CNSMT CO.LTD

Adhesion Testing - How to Do it!

Adhesion Testing - How to Do it!

Videos

Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in

ASKbobwillis.com

Events Calendar: how to solve solder bridging issue (4)

How to Minimize Humidity Interaction with PCBAs for Robustness

Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,

How to Minimize Humidity Interaction with PCBAs for Robustness

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: how to solve solder bridging issue (1)

CCA Production & Process Engineering Technician

Career Center | Killdeer, North Dakota USA | Engineering

SUMMARY OF RESPONSIBILITIES The purpose of this position is to provide guidance and support to the production operations in the area of responsibility and to provide a work environment where coworkers have the tools, training and leadership to build

Killdeer Mountain Manufacturing, Inc.

Career Center - Resumes: how to solve solder bridging issue (6)

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Experienced Engineer

Career Center | Ballston Spa, New York USA | Engineering,Maintenance,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support

Qualifications / Skills: Maintain and repair X-Ray inspection equipment Maintain Surface Mount Manufacturing Systems Full DEK OEM equipment training Train Surface Mount Technology, Semiconductor, and Solar Photovoltaic operators and engineers Mainta

Express Newsletter: how to solve solder bridging issue (1116)

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

---> SMT Express, Volume 3, Issue No. 6 - from SMTnet.com Volume 3, Issue No. 6 Friday, June 15, 2001 Featured Article Return to Front Page PCB Assembly Techniques by Harvey Twyman , University of Kent at Canterbury "I'm sure you

Partner Websites: how to solve solder bridging issue (1350)

De-bridging Knife

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/debridging-knife

  Features and Benefits - Uses precision jet of nitrogen aimed at trailing edge of solder nozzle to eliminate unwanted solder bridges - Jet is adjustable and can rotate around solder nozzle to better execute solder de-bridging

ASYMTEK Products | Nordson Electronics Solutions

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates - I.C

| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html

I.C.T-LV733 How to solve the problem of void, there will be use vacuum reflow soldering machine. Soldering in vacuum environment can fundamentally solve the oxidation of solder in non-vacuum environment, and due to the effect of internal and external pressure difference of solder joint, the


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