This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Industry News | 2021-05-14 06:00:45.0
Megger has switched to Europlacer placement platforms by selecting two new iineo+ pick & placemachines to upgrade its in-house surface mount assembly and replace the functionality of two legacy pick & place machines in one of its lines.
Industry News | 2021-12-28 20:35:34.0
If the refrigerator compressor is broken and can no longer be repaired, you need to buy a new one to replace it. When replacing, you need to follow the correct steps. Then how to change the refrigerator compressor? The following are the detailed steps.
Industry News | 2012-11-08 12:01:36.0
Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2012-08-01 16:27:28.0
LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT. How Stencil Manufacturing Methods Impact Precision and Accuracy will be hosted by Shane Stafford, LPKF market development representative, and presented by Ahne Oosterhof, stencil manufacturing industry expert and founder of A-Laser.
Industry News | 2018-10-06 11:20:42.0
How to Maintain a Reflow Oven?Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality.
Industry News | 2015-04-09 09:41:26.0
Unable to get the conveyors it needed to address customer demands, a system integrator sets out to address the problem on its own and ends up creating not only a new conveyor product, but a different way of designing and manufacturing conveyor lines.
Industry News | 2018-10-18 09:45:34.0
How to Export Gerber Files from Eagle
.gif)
.gif)
