Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea
Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha
Electronics Forum | Fri Jul 09 20:39:31 EDT 2010 | malcolmlanders
I have never placed a bga chip before and need to know some o0f the basics of how to do it. I am really intrested in how the stencil will work with the soider and if there is a special soider that i need to use. I usually use a leaded soider from man
Electronics Forum | Mon May 27 04:46:11 EDT 2019 | SMTA-Rogers
Dear CW, Yes, we also tested many different brands and models of solder paste, under the same stencil design and reflow profile the condition of the voids will have great difference.
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
Electronics Forum | Sun May 27 20:04:10 EDT 2012 | darby
I'm with SWAG. Print a 1:1 transparency of your stencil file and mark it where you want to place the pins. Place it in the product file and use it each time yor run that product. 1. Get the pcb into the print position. 2. Tape your transparency to t
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Mon May 21 16:19:40 EDT 2012 | tbouslog
We are using Ekra Stencil printers and they are great except for 1 problem... We run several different boards a day and we need a way for the operators to place the pin supports in the same postions on the second side of the board everytime a board i
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
