Full Site - : how to use stencil tension gauge (Page 17 of 19)

Stencil-PCB Alignment Mehods - Printing process

Electronics Forum | Fri Dec 09 15:10:55 EST 2011 | davef

Can you use the equipment manual as the basis for learning how to use the machine? Each model of printer has different alignment techniques. We don't have a clue of your model type. So, we'll approach the question from its most basic point. Registe

Re-Useable Stencil Frames

Electronics Forum | Thu Oct 21 21:26:19 EDT 1999 | Dave F

Yims: There's several threads in the archives on re-useable stencil frames, but they seem to be focused on a limited nubmer of suppliers. I'm trying to take a big picture of the suppliers of these frames. So I'd like to know about: 1 ITT ProFrame

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

Re: SQUEEGEE ANGLE

Electronics Forum | Wed Jun 24 00:10:07 EDT 1998 | Phillip Hunter

| WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE USING AN

Solder Paste Volume

Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw

measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi

Solder Paste Evaluation

Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef

We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice

Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl

Tombstoning

Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef

>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.

DPAK's sliding off pad during reflow

Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch

Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th


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