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Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Industry News | 2004-04-05 12:16:15.0
Parvus' Environmental Fan Card II now provides embedded systems with elapsed time counter, unique serial number, force-air cooling, and monitoring of humidity, temperature and air pressure conditions
Industry News | 2010-04-30 14:41:57.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its McDry Electronic Drying Storage Cases and HIROX 3D Digital Microscopes at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Wednesday, May 19, 2010 at the Hilton Toronto Airport Hotel in Toronto, ON.
Industry News | 2010-09-28 02:29:14.0
Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will highlight its INOCART MSD unit and Suitcase-Sized Kit Cart in booth 208 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2011-02-14 14:41:46.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2013-03-22 14:12:00.0
Storagesolutions, today announced that it will exhibit together with its distributor ORTEC MARKETING, EQUIPMENT & SUPPLY LTD in booth 41A at the New Tech Exhibition, scheduled to take place May 7-8, 2013 at the Tel Aviv Fairground in Israel.
Industry News | 2013-04-24 11:21:02.0
Storagesolutions, today announced that it will exhibit in booth 8D036 at the Electronics & Automation 2013 trade fair, scheduled to take place May 28-30, 2013 at the Royal Dutch Jaarbeurs, Utrecht in The Netherlands.
Industry News | 2013-07-29 13:57:39.0
Storagesolutions, a division of ESSEGI SYSTEM SERVICE s.r.l., announces that it will display the ISM2000 (Fortress) Intelligent Storage Management system, together with Juki, in Hall 1, Stand D-1E80 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2013-10-08 16:16:49.0
Storagesolutions, a leading provider of automatic storage systems for the electronics industry and division of ESSEGI SYSTEM SERVICE s.r.l., will exhibit in Hall A3, Stand #201 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
14949 Technology Drive
Eden Prairie, MN USA
Phone: 952-949-2415
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