Full Site - : humidity cabinet (Page 21 of 26)

Moisture free storage units.

Electronics Forum | Thu Jun 19 13:21:53 EDT 2003 | kmccarten

I am currently working with Toyo Living, a manufacturer of Desiccant Dry Boxes. These boxes are specifically deisned for the electronics industry offering options of N2 Purge, or ultra-low flow, Out of spec Humidity alarms, Door Alarms, Data logging

Material Ageing and Storage

Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef

We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS

How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor

MSL | Baking components after expired floor life

Electronics Forum | Tue Sep 13 14:10:13 EDT 2022 | emeto

You can have a dry cabinet with or without heater. They use desiccants to take the humidity out from the parts. As you can imagine it will be a lengthy process. The ones with heater can do 40C, which will be preferred for plastic and paper tapes. I w

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:02:39 EDT 1999 | Dave F

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Gerry: I imagine there could be s

Nitrogen Storage

Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette

Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w

component baking

Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss

I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co

Re: Handling of Moisture sensitive devices

Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F

Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow

Baking for delam prevention

Electronics Forum | Wed Nov 16 18:44:54 EST 2005 | Mike F

A good board used soon after you receive it should not delam. If only a small percentage is doing that I urge you to do some more looking at the board quality while you do the baking. Do a search of the archives on baking boards, Dave F had some good


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