Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F
| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Fri Aug 10 13:52:58 EDT 2001 | davef
When you say that glue viscosity changes for lot to lot, is this LOT TO LOT of your product OR Loctite�s product? And when you say that glue viscosity changes, what do you mean [eg, increase by � , decrease by � , er watt?]. What specifically is th
Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette
Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
