Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
Electronics Forum | Thu Dec 10 12:57:25 EST 2009 | scottp
We've used mostly cartridges for many years and I only saw separation once when a particular paste supplier had a problem. With cartridges it's just thaw and use - no mixing. We have some sites that use jars along with mixers and I've never been co
Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper
The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Tue Jul 11 23:28:59 EDT 2006 | donb
Hi All, I have a continuing problem here with mis-alignment of parts on one of our Fuji CP-3 machines and I thought one of you esteemed engineering types may be able to give me a clue as to where the problem might lie. I have a Fuji trained enginee
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
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