Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Tue Jul 11 23:28:59 EDT 2006 | donb
Hi All, I have a continuing problem here with mis-alignment of parts on one of our Fuji CP-3 machines and I thought one of you esteemed engineering types may be able to give me a clue as to where the problem might lie. I have a Fuji trained enginee
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd
Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil
Electronics Forum | Tue Jul 03 02:42:37 EDT 2012 | kq702
Hi I did a reflow on an HP laptop a while back- it was a DV6000 series. The original problem was the internet stopped working- turns out the south bridge chipset was causing the issue (its a very common issue I found out after searching online). Some
Electronics Forum | Wed Apr 21 22:15:12 EDT 1999 | Chris
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
