Industry Directory | Manufacturer
Manufacturer of a BGA / QFN / SMT rework stations, reflow soldering equipment, reflow ovens, and smt pick and place machines.
New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
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Thick Film Hybrid Circuit manufacturer in Taiwan. aplliance for Telecom line switching, Aotumotive ignition, regulator and any Industrial contrl ...etc. We Accept OEM and ODM design.
New Equipment | Design Services
Military and aerospace electronics providers continue to push the technological envelope to design and manufacture leading edge electronics for today's users. Current design problems are not driven by circuit design capabilities but by an inability t
Events Calendar | Tue Jun 05 00:00:00 EDT 2018 - Thu Jun 07 00:00:00 EDT 2018 | Nuremberg, Germany
SMT Hybrid Packaging 2018 Conference
