Events Calendar | Tue Jun 05 00:00:00 EDT 2018 - Thu Jun 07 00:00:00 EDT 2018 | Nuremberg, Germany
SMT Hybrid Packaging 2018 Conference
Industry Directory | Manufacturer
SP is a high mix low to medium volume PCB + PCBA shop located in Taiwan. We are in business since 2001 with over 1,000 active customers and certified to ISO-9001, ISO-14001 standards.
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Industry News | 2011-06-22 00:31:49.0
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.
Industry News | 2005-02-03 17:41:37.0
David Sbiroli, Senior Applications Engineer with Indium Corporation of America, will be presenting at the IMAPS 2005 Symposium
Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.
Industry Directory | Manufacturer
Arizona ProCoat leads the industry in precision painting, conformal coating, potting and bonding
Industry Directory | Manufacturer's Representative
Offer the best in class equipment & materials to our customers, both in performance as well as support. Work with companies in Oregon, Washington, Idaho, Montana, and the Province of British Columbia.
Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
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