Industry News | 2010-10-14 17:28:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Lockheed Martin LM Connect Conference.
Industry News | 2010-10-29 23:55:24.0
STI Electronics, Inc. will highlight its key engineering services in Booth 119 at the upcoming Defense Manufacturing Conference, scheduled to take place November 29-December 2, 2010 at The Venetian in Las Vegas, NV.
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Industry News | 2011-02-10 13:13:56.0
JEDEC Solid State Technology Association announces that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardization of hybrid memory modules.
Industry News | 2010-11-12 15:29:53.0
STI Electronics announces the 10-year anniversary of Mel Scott, Quality Assurance Manager. In honor of his anniversary, Mel was presented with a travel certificate to be used for a cruise or travel destination of his choice.
Industry News | 2017-04-23 11:52:40.0
Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.
Industry News | 2024-06-28 20:14:47.0
The MVP Aurora features Automated Inspection and Metrology for Packaged IC's, BGA's and Leaded Device's
Industry News | 2023-01-18 11:19:25.0
Vista, CA – January 18, 2023. Machine Vision Products, Inc (MVP) will be exhibiting on booth 924 at the IPC Apex Expo 2023 in the San Diego Convention Center between January 24-26.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
Industry News | 2016-03-17 14:24:23.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.
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