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Akrometrix LLC’s CXP to Be Displayed at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 15:42:29.0

Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.

Akrometrix

Virtual Industries Small Parts Tips on Display at SMT Nuremberg 2013

Industry News | 2013-03-25 15:48:48.0

Virtual Industries Inc., announces that it will display several advanced systems for part handling in the Microtronic Microelectronic Vertriebs GmbH Booth #9-304A at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Virtual Industries, Inc.

Koh Young Highlights Latest Technology at SMT Hybrid Packaging Show

Industry News | 2017-05-25 15:07:23.0

3D inspection technology leader Koh Young Technology showed off its latest technology developments, including the KSMART Solution, Koh Young’s own field-proven AI platform – IP (Intelligent Platform) at the recent SMT Hybrid Packaging 2017 Show in Nuremberg, Germany. The exhibit was timely in part because Koh Young has proven the excellence of KSMART in Germany, the industrial powerhouse where the “Industry 4.0” concept first emerged, according to Wolfgang Runte, Sales Manager of Koh Young Europe.

Koh Young America, Inc.

ICEPT 2017, The 18th International Conference on Electronic Packaging Technology

Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China

ICEPT 2017, The 18th International Conference on Electronic Packaging Technology

Chinese Institute of Electronics (CIE)

SolderStar Selects its Range of Advanced Thermal Profiling Solutions to be Exhibited at SMT Hybrid Packaging Hall 7 Stand 516

Industry News | 2015-03-07 18:35:19.0

SolderStar Ltd, a world leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, will be highlighting a number of innovative products, including its latest advancement in selective soldering, at SMT Hybrid Packaging in Nuremberg, Germany from 5 – 7th May 2015.

Solderstar

Panasonic Broadens Solutions in New England through Creyr Innovation

Industry News | 2015-01-15 09:12:43.0

The entire portfolio of Panasonic Factory Solutions Company of America’s PCBA, Microelectronic, and Professional Service solutions is now represented by Creyr Innovation as a value-added sales representative in the New England area.

Panasonic Factory Solutions Company of America (PFSA)

Inovaxe Strengthens Sales Support in the Pacific Northwest

Industry News | 2012-08-28 13:17:00.0

Inovaxe has appointed Kirby & Demarest as its representative for the Pacific Northwestern United States.

Inovaxe Corporation

CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

Industry News | 2017-04-22 12:08:30.0

CyberOptics® Corporation will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000® 3D Automated Optical Inspection (AOI) system in Hall 4, Stand 101 at the upcoming SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.

CyberOptics Corporation

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE


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