Industry Directory | Manufacturer
Your swiss partner for complex micro-electronic assembly projects.
Industry Directory | Consultant / Service Provider / Manufacturer
Micro Hybrids offers true solutions for your hybrid micro circuit design, layout, production, testing and quality control needs.
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Thick Film Hybrid Circuit manufacturer ib Taiwan. aplliance for Telecom line switching, Aotumotive ignition, regulator and any Industrial contrl ...etc. We Accept OEM and ODM design.
Electronics Forum | Mon Oct 16 20:53:42 EDT 2006 | davef
Here's the paper that Rob referenced above: http://quanterion.com/RIAC/Library/Library.asp?ArgVal=45118-030 It could be that International Society for Hybrid Microelectronics [ISHM] is now International Microelectronics And Packaging Society [IMAPS
Electronics Forum | Thu Jun 12 09:42:06 EDT 2014 | spitkis2
I am looking into Vapor Phase with Vacuum and Inline Reflow with Vacuum (besides Heller I believe a German company SMT has something comparable). There are a couple of companies I found that make vacuum ovens for soldering of hybrid microelectronics
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
Industry News | 2011-06-22 00:31:49.0
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Events Calendar | Tue Jun 05 00:00:00 EDT 2018 - Thu Jun 07 00:00:00 EDT 2018 | Nuremberg, Germany
SMT Hybrid Packaging 2018 Conference
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Fallbrook, California USA | Sales/Marketing
I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in
Career Center | Woodbury, Minnesota USA | Management,Production
Over 20 yrs experience in SMT. Worked with medical, industrial, communications, aerospace and automotive electronics. Have experience working in ITAR controlled companies.
in Microelectronics : Materials, Processes, Reliability, an
SMTnet Express, August 19, 2021, Subscribers: 26,788, Companies: 11,429, Users: 26,806 Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study Flexible hybrid
| https://productronica.com/en/trade-fair/press/press-releases/detail/there-is-no-alternative-to-personal-contact.html
“We are very satisfied. The atmosphere at our booth was really great. I believe one thing in particular: Now is the right time for hybrid trade fairs and events
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
Hybrid 600 Ton Injection Molders, Blenders, Driers, Thermolators, More… Mt Pleasant, IA GenCanna [Online] SOLD - Auction Closed on 8/9/2022 Hemp and CBD Processing Equipment As Late As 2018 Featuring Thar Isolator SFC 60 CO2 Purification System, Careddi
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