Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
VTech CMS DIV. is a main Contract Manufacturing Service Company at Electronics assembly industry (I.E. PCB ASSEMBLY) In South China. By now, we have finished more than 1000 types of PCB ASSEMBLY and have 7 years experience in PCB assembly industry.
Industry Directory | Marketing Agency
We are an International exhibition organiser. M 7 Creations will be organising a b2b exhibition i.e IPCA Electronics Expo India. The exhibition targets mainly PCB Manufacturers and PCB Assembly
Industry Directory | Manufacturer
For Rapid PCB prototype deliveries (48 hours to 3 days), GSPK offer lead free HASL, IMMERSION SILVER or ENIG surface finishes. We can also committed to developing specialist PCBs i.e Ceramic and Heavy Copper PCBs
Industry Directory | Research Institute / Laboratory / School
Vidya Vikas Institute of Engineering & Technology (V.V.I.E.T) was established in 1997. It is a Private University of Engineering and Technology and has been ranked as one of the top 10 engineering colleges in Mysore, Karnataka.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Industry Directory | Consultant / Service Provider / Manufacturer
U.S. based contract manufacturer providing turn-key EMS solutions to defense and commercial OEM's.
Technical Library | 2024-01-08 18:44:00.0
Printed circuit boards, especially multilayer, flexible and rigid-flexible printed circuit boards, are extremely hygroscopic, i.e. they absorb and bind the moisture in the air. A dried polyimide film, for example, will have reached its moisture saturation level again after just a few hours.
Industry Directory | Manufacturer
TRUST SUPPLIES is an I/E and Mfr of pipe rack system, solder dross inhibitor,solder wave machine
