Industry Directory: i3070 series 5 (24)

5pcb.de GmbH

Industry Directory | Manufacturer

We offer PCBs and PCBA from 1 piece to large series. Special Materials, high-tech HDI, flexible and rigid-flex PCBs, SMD stencils and turnkey PCBA. Several surfaces and colours, size from 15x15 to 1000x800mm.

Rich Electric Sales AMerica (RESAM)

Industry Directory | Other

RESAM is the American Representative for the Eric Drives, variable frequency motor controls and vector drives.

New SMT Equipment: i3070 series 5 (595)

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Unisoft ProntoPLACE

Unisoft ProntoPLACE

New Equipment | Software

ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig

UNISOFT Corporation

Electronics Forum: i3070 series 5 (137)

Siemans CS/CF series machine

Electronics Forum | Fri Sep 12 14:30:04 EDT 2003 | serial_killer

Does anyone have these machines yet? They are suppose to be a stripped down version of the S27/F5 platforms. Siemans says they are the same machine but have a diiferent head (6 nozzles vs 12). Do these machine and software run well? Or is it the usua

MPM Ultrapint series 2000

Electronics Forum | Mon Jun 19 21:25:47 EDT 2006 | Chris

Try raising the table in Calibrate mode. Sensor or Tactile connector could be contacting the underside of the rails and overloading the axis. Check for 24V on the Z-axis brake. Check the fuse(F5) and voltage to the driver. Check DIP switch settin

Used SMT Equipment: i3070 series 5 (505)

Agilent Medalist i3070 Series 5

Used SMT Equipment | In-Circuit Testers

Configuration: (1) Windows Controller (2) ASRU N Revision USB Cards (2) Control XTp 64 Cards (18) Hybrid Double Density Cards (2) 6624A Power Supplies (1) External Power Bay Condition: Complete & Operationa

Baja Bid

Agilent i3070

Agilent i3070

Used SMT Equipment | In-Circuit Testers

2012 Agilent i3070 In-Circuit Tester Model: E9903E Series: 5 Description: In-Circuit Tester Configuration: 1 – Controller (O/S is Window7 32 bit, OEM S/W is 8.20) 4 – ASRU N Cards 4 – Control XTp Cards 36 – Hybrid Double Density Cards 4 – 6

Baja Bid

Industry News: i3070 series 5 (741)

Heller Industries to Exhibit at APEX 2013 -Booth 1109

Industry News | 2013-01-04 16:00:38.0

04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.

Heller Industries Inc.

New Dispensing & Conformal Coating Products - Live Demo - Booth 2933, APEX San Diego

Industry News | 2017-01-26 19:53:00.0

GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.

GPD Global

Parts & Supplies: i3070 series 5 (1678)

Yamaha YS series 21w valves

Yamaha YS series 21w valves

Parts & Supplies | SMT Equipment

Yamaha YS series 21w valves Yamaha Feeders YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-000 Yamaha CL 12mm Feeders KW1-M2200-300 Yama

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung SMT original new CN/TN series nozzle

Samsung SMT original new CN/TN series nozzle

Parts & Supplies | SMT Equipment

Samsung original new CN/TN series nozzle if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats ap

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: i3070 series 5 (2)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Technical Library | 2015-12-02 18:32:50.0

(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.

Altera Corporation

Videos: i3070 series 5 (856)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Training Courses: i3070 series 5 (15)

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

Blackfox Training Institute, LLC

IPC J-STD-001 Space Addendum (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Specialist (CIS)

The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.

Blackfox Training Institute, LLC

Events Calendar: i3070 series 5 (5)

Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)

Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,

Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)

Surface Mount Technology Association (SMTA)

Leadership and Communication Training Series

Events Calendar | Thu Aug 08 00:00:00 EDT 2024 - Thu Aug 08 00:00:00 EDT 2024 | ,

Leadership and Communication Training Series

Surface Mount Technology Association (SMTA)

Career Center - Jobs: i3070 series 5 (3)

SMT Maintenance Tech/Engineer

Career Center | Santa Clara, California USA | Maintenance

Coordinator and/or perform preventive maintenance/programming on SMT equipment. Troubleshooting, data analysis, root cause analysis, train SMT machine operators, follow and improve manufacturing processes. Must be familiar with DEK265 Printer, Fuji C

Coast Personnel Services

Test Engineer - Flying Probe

Career Center | Carrollton, Texas USA | Engineering,Production,Technical Support

The primary responsibility of the test engineer is to provide engineering support for ICT and Flying Probe test processes in order to ensure throughput at the test areas. The candidate will be responsible for the following including, but not limite

Sanmina-SCI

Career Center - Resumes: i3070 series 5 (27)

B-Tech/4+Exp as an Service & Production

Career Center | CHENNAI, TAMILNADU India | Engineering,Maintenance,Production,Quality Control,Technical Support

4 years of hands on experience in SMT manufacturing and Process Development where my duties include Programming of SMT machines for different PCBs, operation, process study and maintenance of SMT machines.. Reflow Oven Profiling, according to new d

B-Tech with 6+ Years Exp in SMT Industry

Career Center | Bangalore, Karnataka India | Maintenance,Management,Production,Purchasing,Technical Support

Having 6+ years of experience in Production Process, Production Assembly,AOI, Reflow profiling and Product costing. At present working for Navsemi Technologies as an Production Lead.

Express Newsletter: i3070 series 5 (946)

SMTnet Express - June 5, 2014

SMTnet Express, June 5, 2014, Subscribers: 22800, Members: Companies: 13884, Users: 36269 Stencil Printing Yield Improvements Mike Bixenman, Debbie Carboni, Jason Chan; Kyzen Stencil printing capability is becoming more important as the range

Partner Websites: i3070 series 5 (10654)

5 Soldering Blackfox Courses A la Carte Soldering Series

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/a-la-carte-soldering-series/

5 Soldering Blackfox Courses A la Carte Soldering Series Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2022 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT

Blackfox Training Institute, LLC

UNIVERSAL elctro-valve set VCD series 5 45498801/A | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/45498801-a-elctro-valve-set-vcd-series-5-140446?page=259&category=1111

UNIVERSAL elctro-valve set VCD series 5 45498801/A | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products AI SPARE PARTS elctro-valve set VCD series 5 Public

Qinyi Electronics Co.,Ltd


i3070 series 5 searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
used smt parts china

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Blackfox IPC Training & Certification

Component Placement 101 Training Course
PCB Handling Machine with CE

High Throughput Reflow Oven


500+ original new CF081CR CN081CR FEEDER in stock