motorized version axial component lead cutting and bending machine, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other electronic components foot cutting and bending into U shape assembly Main Features:&
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Used SMT Equipment | Chipshooters / Chip Mounters
Model :KE-2070 pick and place machinePlacement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC)Component mount range:0.4x0.2mm~□33.5mm Station:80Power supply:3P/200~415V/3KVASize:1,400x1, 393x1, 455mmWeight:1,530kg Current
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
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Parts & Supplies | Pick and Place/Feeders
JUKI AF, AN electric feeder: AF24FS E5005706AB0, AF24FS-OP E5007706AB0 AF05HP E1001706AB0, AF081E E1002706AB0 AF081P E1004706AB0, AN081C E1009706AB0 AF16FS E4003706AB0, AF16NS E4004706AB0 AQ02HP 40042271, AF12FS E3003706AB0 JUKI FF electric fee
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
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Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
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NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo
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Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/agriculture-lawn-and-garden?page=11
. Full chemical compatible offering. Easy-to-operate electronic controls. Industrial Coating Systems Screens The use of quality screens from Nordson results in savings in your downstream process, including shortened lead times and decreased costs
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
