New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a
Industry News | 2013-05-13 14:06:16.0
Leading analysts IDTechEx find that the total market for printed, flexible and organic electronics will rocket from $16 Billion in 2013 to $77 Billion in 2023. The majority of that is OLEDs (organic and soon to be printed) and conductive ink used for a wide range of applications of printed electronics. This market will experience 14.5% CAGR over the next 5 years.
Industry News | 2021-08-13 08:33:52.0
Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu Nov 14 21:53:04 EST 2019 | sssamw
I've seen crack on resistor also.The crack on ICs mainly is on the solder joint due to very high strain.
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Mon Apr 01 13:00:27 EST 2002 | BTaylor
We had a problem with conformal coating getting under an IC and with Temp. and vibration would cause cracking of the solder bump, underfill solved the problem.
Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen
Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
