Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
Industry Directory | Manufacturer
Radiotronix set as its goal to create a new generation of highly-integrated IC-style RF module that combined ease of use, enhanced performance and lowered customer cost.
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
New Equipment | Solder Materials
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,
Electronics Forum | Thu Jul 18 11:38:18 EDT 2024 | babe7362000
I am trying to figure out why the stacker goes up when you press the dump button. Then I have to lower it by hand to rehome. It then will rehome and go to where it needs to on the 1st slot.
Electronics Forum | Fri Jan 08 08:29:48 EST 2016 | ahanna
Water can be the issue. After Christmas break we came back to find a fair amount of water build up in our airlines for the building. I will check out the regulator as well as the solenoid. Thank you. I appreciate it.
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
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Parts & Supplies | Pick and Place/Feeders
YAMAHA KGS-M3840-00 wiper KGS-M3840-00 wiper KV8-M71W5-00X STAY 2, I/O, BOARD, YAMAHA head, L shaped support parts KV8-M71WG-00X, BOLT, SPACER, M4-70MM fixation column, YAMAHA head fixed column KV8-M71WF-00X, BOLT, SPACER, M4-75MM fixation colu
Technical Library | 2009-06-17 18:52:27.0
The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed.
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | Rochester, New York USA | Engineering
Kodak - Design, develop, and evaluate new CCD image sensors and image sensor technology as part of a sensor research and development team.Requirements:Extensive experience in CCD designTraining in integrated circuit device physics and operationDemons
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support
• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 96, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
| https://www.eptac.com/ask/bridging-two-adjacent-pins-on-an-ic/
Bridging Two Adjacent Pins on an IC - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-05-released_topic1890.xml
and Yellow statusChanged Transistor Outline (TO, DPAK) to DPAKChanged SOTFL to SOFL and added the IC component familyRemoved all A1 dimensions from Through-hole dimensional thumbnail imagesIncreased the Window Splitter line
