Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2010-04-28 18:06:35.0
GAINESVILLE, GA ― Count On Toos Inc., a leading provider of precision components and SMT spare parts, introduces its new MYDATA Hydra replacement nozzles and consumables.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
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