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Mydata MY100e Series Pick-and-Place Machines

Mydata MY100e Series Pick-and-Place Machines

New Equipment | Pick & Place

Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t

Mycronic AB

Magnalytix to Tout Industry-leading Testing Services at APEX 2024

Industry News | 2024-03-18 12:59:34.0

Magnalytix will exhibit at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. The company will promote its capabilities as the industry's largest provider of third-party SIR testing services and comprehensive reporting of Objective Evidence at Booth #2811.

Magnalytix

New Era in Testing DUT over Temperature

Industry News | 2016-05-13 11:56:03.0

The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.

Mechanical Devices

New Era in Testing DUT over Temperature

Industry News | 2016-05-13 12:00:12.0

The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.

Mechanical Devices

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Industry News | 2020-10-04 15:41:30.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award

Industry News | 2023-01-30 16:07:57.0

SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.

Shenmao Technology Inc.

Motion Sensor with Machine Learning-LSM6DSOX

Industry News | 2019-02-15 05:28:59.0

STMicroelectronics announced the integration of machine learning technology into its advanced inertial sensors to improve the motion tracking performance and battery life of mobile phones and wearables.

Jotrin Electronics Limited

SchmartBoard Unveils SchmartBoard|ez at DEMOfall 2005

Industry News | 2005-09-23 17:40:31.0

A ten year old can now do what 99% of electrical engineers could not ..

SchmartBoard, inc.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

New Startup Combines Therapeutics and Microelectronics to Deliver Highly Innovative Products and Solutions

Industry News | 2015-12-09 11:51:49.0

Microtek is proud to announce the opening of its Corporate Headquarters at 10865 Rancho Bernardo Road, Suite 101, San Diego, CA.

Microtek, Inc.


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