Industry Directory | Manufacturer
Reechas is a high-tech enterprise founded in 2006 and headquartered in Shenzhen, China. We focus on the development, production, and sales of integrated laminating products, including release films, conformal films, and press pad
Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
Hanwha SM485P Pick and Place Machine Placement speed: 12,000 CPH (Optimum) Machine dimension: 1650*1679*1993mm Weight: Approx 1600kg SM485P is a multifunctional Hybrid Pick and Place Machine. In addition to SMD components, it can quickly and reliabl
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Thu Dec 26 12:41:53 EST 2019 | emeto
We agree with your statements. 1. Having manually printed board will compromise your print and you don't know how much paste you have on each pad. 2. LEDs falling off that easily might be related to contamination, considering that your profile is not
Electronics Forum | Wed Dec 04 10:59:04 EST 2019 | dwl
The solder looks a little grainy for Sn/Pb solder but that might just be the picture quality. There appears to be plenty of solder on the pads, so I'd rule out anything to do with the stencil. One possibility that springs to mind; how long is your
Used SMT Equipment | AOI / Automated Optical Inspection
MV-6e SeriesThe world’s best 2D AOI system The world’s best performance 2D AOI – Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens– Inspection for diffuse reflection component, OCR, micro crack pr
Used SMT Equipment | AOI / Automated Optical Inspection
MV-6e SeriesThe world’s best 2D AOI system The world’s best performance 2D AOI – Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens– Inspection for diffuse reflection component, OCR, micro crack pr
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
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Parts & Supplies | Pick and Place/Feeders
JUKI 760 2050M IC tray RE0150000K0 SNAP RING 1.5 PX500056000 VACUUM PAD →PX500060000 PX500057000 VACUUM PAD 6 →PX500061000 PX500058000 VACUUM PAD →PX500062000 PX500060000 VACUUM PAD PX500061000 VACUUM PAD PX500062000 VACUUM PA
Parts & Supplies | Pick and Place/Feeders
S20 RV12 head 321406 HS50 RV12 head 335980 F5HM RV6 head 345515 HS50 PCB Camera 344065 PCB camera bulb 316823 RV12 component camera 336791 RV6 component camera 346264 RV12 Octopus 341181 RV6 Octopus 344772 DLM1 Z-Axis Slider 320165
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/wrong-pad-selection_topic1122_post4420.html
Wrong pad selection??? - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > EAGLE New Posts FAQ Search Events Register Login Wrong pad selection
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: SHENZHEN High Light: JUKI Manual tray Plate , JUKI feeder IC tray Product Description JUKI SMT Machine spare part JUKI Manual tray Plate Dimension
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