Improve test coverage and reduce cost. The XJTAG XJLink2-CFM adds the power of XJTAG’s boundary scan solution to the Teradyne TestStation, giving test access to hard-to-probe parts of a board. Both JTAG and non JTAG devices, such as Flash, RAM, Eth
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
New Equipment | Component Programming
The JTAGMaster Tester and Programmer is a fully integrated solution for the configuration and diagnosis of Programmable Logic Devices (PLDs). This unit includes : * A boundary-scan tester to arbitrarily observe individual pins and therefore determine
Used SMT Equipment | In-Circuit Testers
Takaya Model APT8400 Flying Prober, Fixtureless Tester with AOI Vision •4 Probe Highspeed In-Circuit system •Bottom side 2 adjustable probes •Display 14 or 15 inch CRT Colour Monitor, VGA •Automatic Correction Function for X, Y co-ordinates •P
New Equipment | Industrial Automation
Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R
New Equipment | Industrial Automation
Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Z-Communications PLL modules are designed for use in any variety of today�s commercial wireless applications. Current solutions are available from 100 MHz to 5.5 GHz and can be programmed to lock at specific frequencies through a 3-wire CMOS serial i
Industry News | 2018-03-29 11:46:12.0
2018 Service Excellence Award Presented at IPC APEX EXPO
Industry News | 2018-04-10 09:15:14.0
2018 New Product Introduction Award Presented at IPC APEX EXPO
