This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
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Used SMT Equipment | Pick and Place/Feeders
Modern high performance Manncorp / Autotronik pick and place machine with 60 electronic smart feeders. The current model is the MA392v1 or BA392v1 and both have a base price of around 70,000.00. It is my understanding that this machine has all the sa
Industry News | 2013-05-14 12:24:08.0
Multitest offers innovative approaches for test strategies of 3D ICs and Sensors – Meet Multitest at ECTC, May 28-30, Las Vegas
Device control via internal JTAG access - processor and FPGA cores While many ICs are equipped with a JTAG (IEEE Std. 1149.1) boundary-scan register (BSR), a significant number of microprocessors and DSPs can be found with deficient or even non-exi
AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab
Otek AOI is an Automatic Optic Inspection Equipment developed and manufactured by the GFirst OEIC Co., Ltd., in Xiamen, China. Given the level of operators and the practical manufacturing environment they work in, the design tenet of Otek AOI is its
Industry News | 2002-04-11 08:38:03.0
A Joint-development Initiative for Environmentally Friendly, "Economically Viable" Wafer Cleaning Technology
Industry News | 2017-01-25 10:06:49.0
Register today for the 11th Annual International Electrostatic Workshop (IEW) being held May 7-11, 2017 at the Granlibakken Conference Center & Lodge, Lake Tahoe, CA USA The IEW facilitates access to and interactions with industry leaders through invited seminars, technical sessions, special interest groups (SIGs), discussion groups (DGs), and invited speakers. This year we focus on The Intersection of ESD Challenges for Emerging/Advancing Technologies and Markets; IC Designer’s Perspective on ESD; and Everything EOS – Product, Failure Analysis, Reliability, Verification, and Test Engineers. Participating at the IEW will provide: • An immersive, interactive experience with experts on technical advancements • All-inclusive pricing – workshop, hotel, and meals • Peer reviewed poster format for future full paper development • Gain valuable industry recognition and receive feedback • Interactive and in-depth discussion groups
