Industry News | 2009-11-06 17:10:00.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
Industry News | 2008-12-06 02:08:39.0
Anaheim, CA � The SMTA is pleased to announce the 2009 SMTA Anaheim Academy program. SMTA Anaheim will be held February 10-11, 2009 at the Anaheim Convention Center in conjunction with Electronics West. This year's program will feature six half-day Courses led by leading instructors in the industry.
Industry News | 2019-08-21 16:21:55.0
The SMTA will organize the “Additive Electronics Conference: PCB Scale to IC Scale” on October 24, 2019 at the DoubleTree by Hilton San Jose in San Jose, California. The conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
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