Industry News | 2023-04-03 13:24:06.0
IPC welcomes the action of U.S. President Joe Biden today in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).
Industry News | 2013-03-19 11:53:04.0
The SMTA Capital Chapter is pleased to announce its upcoming meeting on March 26, 2013, from 5:30 pm until 8 pm at Harford Community College in Aberdeen, Maryland.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2014-11-03 19:28:27.0
SMTA announced that the program is finalized for the 20th Annual Pan Pacific Microelectronics Symposium.
Industry News | 2013-07-03 11:36:59.0
The SMTA announced the addition of a new symposium to the SMTA International conference program.
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2024-01-15 14:07:45.0
The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, the electronics manufacturing association, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
Industry News | 2009-07-24 14:12:49.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
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