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MARCH StratoSPHERE Plasma Treatment System

MARCH StratoSPHERE Plasma Treatment System

New Equipment | Surface Finish

Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications.  The StratoSPHERE plasma system is ideal for wafer pro

MARCH Products | Nordson Electronics Solutions

Virtual Industries Debuts PORTA-VAC� II Kit With Molded Peek� Wafer Tip

Industry News | 2009-06-08 23:31:02.0

COLORADO SPRINGS, CO � June 2009 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces the availability of the PORTA-VAC II with wafer tip VMWT-C, capable of handling up to 8" (200 mm) wafers.

Virtual Industries, Inc.

ESD Plastic Trays

ESD Plastic Trays

New Equipment | IC Packaging

Name: Vacuum Formed Trays, ESD Shipping Trays, Plastic Trays Material: PS, PETG, ABS, PVC AntiStatic Certificates: RoHs, ISO14001 Payment Term: 100% T/T Capacity: 100000pcs/week MOQ: 5000 pieces Sample Time: 5 days including tooling making Lead Time

Shenzhen Sewate Technology Co.,Ltd

New high current, Low Profile SMT PA500X series inductors released by Pulse Electronics

Industry News | 2018-08-02 04:41:30.0

The PA500X Series SMT Inductors are offered in PA5001, PA5002, PA5003, PA5004, PA5005, PA5006, and PA5007 models. The PA500X series inductors are available in five platform sizes in ranging from 4 x 4 to 8 x 8 mm with profile height down to 2.1 mm.

Jotrin Electronics Limited

Practical Components Introduces New Kit for Test and Qualification of the Amkor TMV® Component

Industry News | 2011-06-13 18:06:01.0

Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.

Practical Components, Inc.

Adhesives & Bonding Expo

Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA

Adhesives & Bonding Expo

Scheugenpflug Inc.

Heraeus Electronics to Debut New Silver Sinter Paste for Module Attach Applications at PCIM Europe

Industry News | 2024-05-27 12:39:02.0

Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13, 2024 in Nuremberg, Germany. This latest advancement aims to revolutionize thermal performance in electronic manufacturing, addressing industry challenges head-on.

Heraeus

YXLON FF35 CT High Resolution Industrial CT System for Small/Medium Size Parts Inspection

YXLON FF35 CT High Resolution Industrial CT System for Small/Medium Size Parts Inspection

New Equipment | Inspection

The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection

YXLON International

New Yorker Electronics now Supplying Advanced Aluminum Casting Alloys from Amfas International

Industry News | 2020-12-29 19:40:56.0

Amfas State-of-the-Art Casting Alloys for High Strength and High Thermal Conduction Designed for Electronics Applications

New Yorker Electronics

VPG Foil Resistors Ultra-High Precision Molded Surface Mount Resistor Features Z1 Foil Technology

Industry News | 2021-05-11 14:58:49.0

Z1 Foil Technology improves overall environmental performances and long-term stability

New Yorker Electronics


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