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A brief demonstration showing the 2014 YESTech FX operating

A brief demonstration showing the 2014 YESTech FX operating

Videos

This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com

Capital Equipment Exchange

EKT Double Track Online AOI System

EKT Double Track Online AOI System

Videos

EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo

EKTION (SHENZHEN) TECHNOLOGY LIMITED

BGA, PoP, SMT, Coating Photo library open for training

Industry News | 2013-07-29 10:38:07.0

A picture is worth a thousand words so they say. So say it with photos

ASKbobwillis.com

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Technical Library | 2020-07-02 13:29:37.0

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.

Alpha Assembly Solutions

Using Stencil: Design to Reduce SMT Defects

Technical Library | 2023-06-12 19:46:10.0

Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1.

AVI Precision Engineering Pte Ltd

X2.5 Automated In-line X-ray Inspection (Transmission, 3D-SFT, Off-Axis)

X2.5 Automated In-line X-ray Inspection (Transmission, 3D-SFT, Off-Axis)

New Equipment | Inspection

Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of

MatriX Technologies GmbH

TRC Circuits Inc

Industry Directory | Consultant / Service Provider / Manufacturer

TRC Circuits provides high quality printed circuit boards to a wide range of industries. We have 23 years of experience manufacturing printed circuit boards.

The printer series GL and PMAXII provide more features than all other printers available in the market.

The printer series GL and PMAXII provide more features than all other printers available in the market.

Videos

The printer series GL and PMAXII provide more features than all other printers available in the market. Additionally, free software upgrades throughout the printer's lifetime are available. This proven quality product offers unequalled opportunities

Juki Automation Systems

S3016 - Bottom-Up AOI

S3016 - Bottom-Up AOI

New Equipment | Inspection

Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed

Viscom AG

Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing

Technical Library | 2018-03-21 22:44:30.0

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified.

Kimball Electronics, Inc.


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